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Magazine Name : Ieee Transactions On Components And Packaging Technologies

Year : 2001 Volume number : 24 Issue: 04

Steady State Analysis Of Cooling Electronic Circuits Using Heat Pipes (Article)
Subject: Heat Pipes , Natural And Forced Convection Cooling , Radiator
Author: Jarostaw Legierski      Bogustaw Wiecek     
page:      549 - 553
Transient Thermal Characterization Of The Polymer Stud Grid Array (Article)
Subject: Packaging , Polymer Stud , Thermal Characteristics
Author: Evelien Driessens      Eric Beyne      Bart Vandevelde     
page:      554 - 558
Two Benchmarks To Facilitate The Study Of Compact Thermal Modeling Phenomena (Article)
Subject: Compact Model , Thermal Characteristics , Thermal Analysis
Author: C. J. M. Lasance     
page:      559 - 565
Electrothermal Cad Of Power Devices And Circuits With Fully Physical Time-Dependent Compact Thermal Modeling Of Complex Nonlinear 3-D Systems (Article)
Subject: Electrothermal
Author: William Batty      Stephane David     
page:      566 - 590
Experimental Study On The Performance Of Miniature Heat Pipes With Woven-Wire Wick (Article)
Subject: Capillary Pressure , Electronic Cooling , Operating Data
Author: Seok Hwan Moon      Ho Gyeong Yun      Gunn Hwang     
page:      591 - 595
Dynamic Thermal Multiport Modeling Of Ic Packages (Article)
Subject: Package Modeling , Reduced -Order Systems , Thermal Modeling
Author: Marta Rencz      Vladimir Szekely     
page:      596 - 604
Calculating Effective Board Thermal Parameters From Transient Measurements (Article)
Subject: Thermal Conductivity , Measurement , Thermal
Author: Vladimir Szekely      Sandor Ress     
page:      605 - 610
Challenges In Thermal Modeling Of Electronics At The System Level Summary Of Panel Held At The Therminic 2000 (Article)
Subject: Challenges
Author: C. J. M. Lasance      J.T. Rantala     
page:      611 - 615
A Novel Approach For Flip Chip Solder Joint Quality Inspection Laser Ultrasound And Interferometric Systeem (Article)
Subject: Bga , Chip Cards , Error Rate
Author: Sheng-Li Liu      I. Charles Ume      Juergen Gamalski     
page:      616 - 624
An Automated Workcell For Meniscus Coating On 24-In Packaging Substraters (Article)
Subject: Computer Aided Engineering , Large Area Cell , Mcm
Author: Swapan K. Bhattacharya      Sachin Bhatevara      Gary S. May     
page:      625 - 630
Modular, Device-Scale, Direct-Chip Attach Packaging For Microsystems (Article)
Subject: Electronic Packaging , Microsystem Cad , Packaging
Author: Jordan Neysmith      Daniel F. Baldwin     
page:      631 - 634
Parametric Reliability Analysis Of No-Underfill Flip Chip Package (Article)
Subject: Ceramic Anode , Flip-Chip , Underfill Processing
Author: Kuo-Ning Chiang      Zheng-Nan Liu      Chih-Tang Peng     
page:      635 - 640
Implementing Asic/Memory Integration By System-On Package (Article)
Subject: Asic , Dram , System-On-Chip
Author: R. H Tsai      C.-L Lin      Kuo-Tai Tseng     
page:      641 - 644
Sticking Effect On Center-Anchored Circular Plates In Microstructures (Article)
Subject: Capillary Flow , Surface Tension , Stick-Slip
Author: Meng-Ju Lin      Rongshun Chen     
page:      645 - 649
Wafer Level And Flip Chip Design Through Solder Prediction Models And Validation (Article)
Subject: Bump Characterization , Solder Joint Reliability , Wafer
Author: Li Li      Betty H. Yeung     
page:      650 - 654
Reliability Evaluations Of Under Bump Metallurgy In Two Solder Systems (Article)
Subject: Electronic Packaging , Pull-Out , Reliability , Solder Joint Reliability
Author: Yifan Guo      Chales Zhang      Shun-Meen Kuo     
page:      655 - 660
A Method To Improve The Efficiency Of Cmp Process (Article)
Subject: Chemical Mechanical Polishing , Clamping Conditions , Efficiency Improvement
Author: D. G Shaw      Jassy Chang     
page:      661 - 666
Methodology For Studying The Impact Of Intrinsic Stress On The Reliability Of The Electroless Ni Ubm Structure (Article)
Subject: Electroless , Ubm Reliability , Under The Hood
Author: J. A Michell      Yifan Guo     
page:      667 - 672
Transient Thermal Analysis Of An Acf Package Assembly Process (Article)
Subject: Anisotropic Consolidation , Manufactureing , Thermal Performance
Author: Victor Adrian Chiriac      Tien-Yu Tom Lee     
page:      673 - 681
Effect Of Cu Stud Microstructure And Electroplating Process On Intermetallic Compounds Growth And Reliability Of Flip Chip Solder Bump (Article)
Subject: Copper , Electroplating , Flip-Chip , Growth
Author: Guo-Wei Xiao      Philip C. H. Chan      Jian Cai     
page:      682 - 690
Electroless Ni Cu P Barrier Between Si/Ti/Al Pad And Sn-Pb Flip-Chip Solder Bumps (Article)
Subject: Diffusion Barriers , Electroless Nickel Plating , Flip-Chip
Author: Chun-Jen Chen      Kwang-Lung Lin     
page:      691 - 697
Double-Sided Cooling For High Power Igbt Modules Using Flip Chip Technology (Article)
Subject: Heat Sink , Igbt , Interconnections
Author: Charlotte Gillot      Christian Schaeffer      Luc Meysenc     
page:      698 - 704
Thermal Cycling Analysis Of Flip-Chip Solder Joint Reliability (Article)
Subject: Fatigue , Flip-Chip , Reliability
Author: John H. L. Pang      D. Y. R. Chong     
page:      705 - 712
Material Characterization And In-Situ Process Monitoring For A Robust Acf Base Flip Chip Technology (Article)
Subject: Anisotropic Constraint Effects. , Interconnect
Author: Yoshio Okada      Takayoshi Katahira     
page:      713 - 720
Junction Temperature Considerations In Evaluating Electronic Parts For Use Oputside Manufacturers Specified Temperature Ranges (Article)
Subject: Thermal Resistance , Parts , Junction Temperature
Author: Lioyd Condra      Diganta Das      Michael G. Pecht     
page:      721 - 728
Pparameter Recharacterization A Method Of Thermal Uprating (Article)
Subject: Parameter Correction , Stress Block , Uprating
Author: Diganta Das      Michael G. Pecht     
page:      729 - 737