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Your search returned 26 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2001 Volume number : 24 Issue: 04 |
Steady State Analysis Of Cooling Electronic Circuits Using Heat Pipes
(Article)
Subject:
Heat Pipes
,
Natural And Forced Convection Cooling
,
Radiator
Author:
Jarostaw
Legierski
Bogustaw
Wiecek
page:
549
-
553
Transient Thermal Characterization Of The Polymer Stud Grid Array
(Article)
Subject:
Packaging
,
Polymer Stud
,
Thermal Characteristics
Author:
Evelien
Driessens
Eric
Beyne
Bart
Vandevelde
page:
554
-
558
Two Benchmarks To Facilitate The Study Of Compact Thermal Modeling Phenomena
(Article)
Subject:
Compact Model
,
Thermal Characteristics
,
Thermal Analysis
Author:
C. J. M.
Lasance
page:
559
-
565
Electrothermal Cad Of Power Devices And Circuits With Fully Physical Time-Dependent Compact Thermal Modeling Of Complex Nonlinear 3-D Systems
(Article)
Subject:
Electrothermal
Author:
William
Batty
Stephane
David
page:
566
-
590
Experimental Study On The Performance Of Miniature Heat Pipes With Woven-Wire Wick
(Article)
Subject:
Capillary Pressure
,
Electronic Cooling
,
Operating Data
Author:
Seok Hwan
Moon
Ho Gyeong
Yun
Gunn
Hwang
page:
591
-
595
Dynamic Thermal Multiport Modeling Of Ic Packages
(Article)
Subject:
Package Modeling
,
Reduced -Order Systems
,
Thermal Modeling
Author:
Marta
Rencz
Vladimir
Szekely
page:
596
-
604
Calculating Effective Board Thermal Parameters From Transient Measurements
(Article)
Subject:
Thermal Conductivity
,
Measurement
,
Thermal
Author:
Vladimir
Szekely
Sandor
Ress
page:
605
-
610
Challenges In Thermal Modeling Of Electronics At The System Level Summary Of Panel Held At The Therminic 2000
(Article)
Subject:
Challenges
Author:
C. J. M.
Lasance
J.T.
Rantala
page:
611
-
615
A Novel Approach For Flip Chip Solder Joint Quality Inspection Laser Ultrasound And Interferometric Systeem
(Article)
Subject:
Bga
,
Chip Cards
,
Error Rate
Author:
Sheng-Li
Liu
I. Charles
Ume
Juergen
Gamalski
page:
616
-
624
An Automated Workcell For Meniscus Coating On 24-In Packaging Substraters
(Article)
Subject:
Computer Aided Engineering
,
Large Area Cell
,
Mcm
Author:
Swapan K.
Bhattacharya
Sachin
Bhatevara
Gary S.
May
page:
625
-
630
Modular, Device-Scale, Direct-Chip Attach Packaging For Microsystems
(Article)
Subject:
Electronic Packaging
,
Microsystem Cad
,
Packaging
Author:
Jordan
Neysmith
Daniel F.
Baldwin
page:
631
-
634
Parametric Reliability Analysis Of No-Underfill Flip Chip Package
(Article)
Subject:
Ceramic Anode
,
Flip-Chip
,
Underfill Processing
Author:
Kuo-Ning
Chiang
Zheng-Nan
Liu
Chih-Tang
Peng
page:
635
-
640
Implementing Asic/Memory Integration By System-On Package
(Article)
Subject:
Asic
,
Dram
,
System-On-Chip
Author:
R. H
Tsai
C.-L
Lin
Kuo-Tai
Tseng
page:
641
-
644
Sticking Effect On Center-Anchored Circular Plates In Microstructures
(Article)
Subject:
Capillary Flow
,
Surface Tension
,
Stick-Slip
Author:
Meng-Ju
Lin
Rongshun
Chen
page:
645
-
649
Wafer Level And Flip Chip Design Through Solder Prediction Models And Validation
(Article)
Subject:
Bump Characterization
,
Solder Joint Reliability
,
Wafer
Author:
Li
Li
Betty H.
Yeung
page:
650
-
654
Reliability Evaluations Of Under Bump Metallurgy In Two Solder Systems
(Article)
Subject:
Electronic Packaging
,
Pull-Out
,
Reliability
,
Solder Joint Reliability
Author:
Yifan
Guo
Chales
Zhang
Shun-Meen
Kuo
page:
655
-
660
A Method To Improve The Efficiency Of Cmp Process
(Article)
Subject:
Chemical Mechanical Polishing
,
Clamping Conditions
,
Efficiency Improvement
Author:
D. G
Shaw
Jassy
Chang
page:
661
-
666
Methodology For Studying The Impact Of Intrinsic Stress On The Reliability Of The Electroless Ni Ubm Structure
(Article)
Subject:
Electroless
,
Ubm Reliability
,
Under The Hood
Author:
J. A
Michell
Yifan
Guo
page:
667
-
672
Transient Thermal Analysis Of An Acf Package Assembly Process
(Article)
Subject:
Anisotropic Consolidation
,
Manufactureing
,
Thermal Performance
Author:
Victor Adrian
Chiriac
Tien-Yu Tom
Lee
page:
673
-
681
Effect Of Cu Stud Microstructure And Electroplating Process On Intermetallic Compounds Growth And Reliability Of Flip Chip Solder Bump
(Article)
Subject:
Copper
,
Electroplating
,
Flip-Chip
,
Growth
Author:
Guo-Wei
Xiao
Philip C. H.
Chan
Jian
Cai
page:
682
-
690
Electroless Ni Cu P Barrier Between Si/Ti/Al Pad And Sn-Pb Flip-Chip Solder Bumps
(Article)
Subject:
Diffusion Barriers
,
Electroless Nickel Plating
,
Flip-Chip
Author:
Chun-Jen
Chen
Kwang-Lung
Lin
page:
691
-
697
Double-Sided Cooling For High Power Igbt Modules Using Flip Chip Technology
(Article)
Subject:
Heat Sink
,
Igbt
,
Interconnections
Author:
Charlotte
Gillot
Christian
Schaeffer
Luc
Meysenc
page:
698
-
704
Thermal Cycling Analysis Of Flip-Chip Solder Joint Reliability
(Article)
Subject:
Fatigue
,
Flip-Chip
,
Reliability
Author:
John H. L.
Pang
D. Y. R.
Chong
page:
705
-
712
Material Characterization And In-Situ Process Monitoring For A Robust Acf Base Flip Chip Technology
(Article)
Subject:
Anisotropic Constraint Effects.
,
Interconnect
Author:
Yoshio
Okada
Takayoshi
Katahira
page:
713
-
720
Junction Temperature Considerations In Evaluating Electronic Parts For Use Oputside Manufacturers Specified Temperature Ranges
(Article)
Subject:
Thermal Resistance
,
Parts
,
Junction Temperature
Author:
Lioyd
Condra
Diganta
Das
Michael G.
Pecht
page:
721
-
728
Pparameter Recharacterization A Method Of Thermal Uprating
(Article)
Subject:
Parameter Correction
,
Stress Block
,
Uprating
Author:
Diganta
Das
Michael G.
Pecht
page:
729
-
737
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